The CXG filament winder is a standardized filament winder with all the standard product line benefits such as optimized price, reduced lead time, trusted reliability, and flexibility for future expansion.
The SPG series of low-weight (1.1 oz) and low profile (0.37 in) SiC full bridge power modules with an integrated gate drive use power chip on board technology for optimal high power density in high-reliability applications. Available to 1200V, 60A.
This package includes one Concealable Plate Carrier and two Level IIIA Panels. The Concealable Plate Carrier is designed to be just that - concealable. It is lightweight, low profile, and comfortable.
Bemsco is dedicated and committed to meeting the exacting standards of the Aerospace industry in the manufacture of a wide variety of aircraft, commercial, OEM and ground related accessories.
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