We provide precision bearing solutions for a variety of highly technical applications derived from years of experience and thorough knowledge of the complications of semiconductor manufacturing environments.

SEMICONDUCTOR MANUFACTURING APPLICATIONS

Schatz designs and manufactures several ball bearing configurations for semiconductor processing equipment. Bearing configurations can be thin section, angular contact, pre-loaded duplex sets, or custom designed combinations; optimized to maximize performance based on torque, stiffness, and life requirements.

• Wafer Processing

• Robotics

• Polishers

• Photolithography Equipment

• Dryers

• Process Improvement

• Spin dryers

• Vacuum Environment Applications

FEATURES

• Optional stainless steel construction (CRES & CREN Steels)

• Hybrid material combinations available, including SiNi balls

• High-precision running accuracy

• Precision levels ABEC 1F, 3F, 5F, or 7F

• Bearing bores up to 14”

• Thin section cross-sections of 3/16”, 1/4”, 5/16”, 3/8”, 1/2”, 5/8”, 3/4”, and 1”

• Lubrication combinations specific for extended life in semiconductor processing equipment

• Custom and industry accepted sealing options

• Assembled in world-class ISO Class 6 authorized clean room